solvent

专利名称：SOLVENTCOMPOSITIONFORCONDUCTIVE

PASTE,VEHICLE,ANDCONDUCTIVEPASTE

发明人：HONDA,Eri,本田絵里,TAKATA,Shigeto,高田茂

人,MICHIDA,Minoru,道田実

申请号：JP2019/037508

申请日：20190925

公开号：WO2020/071198A1

公开日：20200409

专利内容由知识产权出版社提供

摘要：Providedareasolventcompositionforconductivepaste,avehicleusingthe

same,andaconductivepastethatdonotgiveritointerlayerdelaminationcaudby

thephenomenonofsheetattack,dryreadilyviaevaporation,andhavesuitableviscosity

properties,andthatareformanufacturingmulti-layerceramiccomponentswhichdonot

ventcompositionforconductivepaste

contains(A)amonoterpenealcoholand/oramonoterpenefattyacidester,and(B)a

lacticacidalkylester.

申请人：YASUHARACHEMICALCO.,LTD.,ヤスハラケミカル株式会社

地址：1080,Takagi-cho,Fuchu-shi,Hiroshima7268632JP,〒7268632広島県府中市高木町

１０８０番地HiroshimaJP

国籍：JP,JP

代理人：SHIRAIShigetaka,白井重隆

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